Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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Printed, Flexible and Organic Electronics
1 Jun 2023

Additive Electronics

Additive Electronics is an early stage company that will offer equipment and materials for manufacturing fully additive 3D electronics components from 2024. IDTechEx caught up with CEO Felix Michl to find out more.
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22 May 2023

Component Attach: Market readiness of solders & conductive adhesives

An innovation roadmap comparing component attachment size for sustainable electronics manufacturing.
19 May 2023

How Can Smart Packaging Best Add Value?

What is packaging for? From its initial purpose of simply protecting the product to driving sales via consumer engagement, the role of packaging has substantially evolved. Smart/intelligent packaging continues this trend towards greater functionality, employing sensors, printed electronics, and wireless communication to add value in novel ways.
19 May 2023

Smart Packaging Industry Overview

Innovation roadmap for the smart packaging industry.
15 May 2023

IDUN Technologies

IDUN Technologies is developing neural interface technology, using in-ear EEG. Tess Skyrme, Technology Analyst at IDTechEx, interviewed CEO, Simon Bachmann.
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15 May 2023

Advanced Semiconductor Packaging: Trends and Growth Drivers

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.
11 May 2023

Market Readiness of Perovskite Applications

Innovation roadmap for perovskite applications' market readiness.
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9 May 2023

Exploring the Growth and Market Breakdown of Passive RFID

The RFID industry is expected to maintain its growth trajectory, with IDTechEx forecasting a market value of US$14 billion in 2023, up from US$12.8 billion in 2022. This market value encompasses various RFID form factors, including labels, cards, fobs, and tags, as well as scanners, software, and services for both active and passive RFID technologies. Among these, the "Passive RFID Tags" segment stands out as the largest, comprising more than half of the total RFID market.
5 May 2023

Unravelling Competing In-Mold Electronics Manufacturing Methodologies

Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common. Applications range from vehicle interiors and domestic appliances to medical devices and aircraft seating. Rather than relying on a mechanical or membrane switch, these surfaces utilize capacitive touch sensing - the same principle used in smartphone displays.
3 May 2023

AI Driven Quality Assurance for "Fully Additive" 3D Printed Electronic

Neotech AMT and the TAMS-group at the University of Hamburg announce successful implementation of a camera-based monitoring system for Additively Manufactured objects with integrated electronics (Project: KAM EI). The project, funded by Central Innovation Program for SMEs (ZIM) from the German Federal Federal Ministry for Economic Affairs and Energy (BMWi), started in September 2020.
2 May 2023

ATT (Advanced Thermal Technologies)

ATT is collaborating with Henkel to develop heating for automotive interiors based on positive temperature coefficient (PTC) ink and advanced driver assistance systems (ADAS) sensor cover heaters utilizing in-mold electronics (IME). IDTechEx caught up with Head of Printed Electronics Martin Hartinger at LOPEC 2023.
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1 May 2023

Upcoming Webinar - Smart Packaging: Emerging Drivers and Technologies

Wednesday 17 May 2023 - Multiple smart packaging technologies, including embedded lighting, wireless energy harvesting, flexible batteries, and low-cost sensing; Case studies showing the deployment and adoption of different types of smart packaging, such as electronic blister packs for pharmaceuticals; A roadmap for the adoption of different smart packaging technologies, and assessment of technology gaps and other adoption barriers
28 Apr 2023


Wiliot offers battery-free smart tags and an associated software ecosystem for tracking objects both in supply chains and after purchase. IDTechEx caught up with Chief Marketing Officer Steve Statler to find out more about the latest developments.
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26 Apr 2023

Application Opportunities for Reconfigurable Intelligent Surfaces

This premium article explores the various application opportunities for reconfigurable intelligent surfaces (RIS).
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25 Apr 2023

TactoTek adds TracXon Solutions to enhance supply of IMSE Technology

Finnish IMSE pioneer TactoTek and TracXon, an innovative spin-off of the Holst Centre, have signed a license agreement
25 Apr 2023

Helio Display Materials

Helio Display Materials is an early-stage UK company developing nanocrystal perovskite films for color conversion in display applications, aiming to replace the commonly used quantum dot technology. This profile is based on an SID (Society for Information Display) presentation and Q&A session with CTO Bernard Wenger.
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24 Apr 2023

The In-Mold Electronics (IME) Value Chain

This article covers the value chain, key suppliers and activity by region for In Mold Electronics.
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21 Apr 2023

AI for Sustainability: How Materials Informatics is Driving Change

Materials informatics is the application of data-driven methods, including machine learning techniques, to the field of materials science. This important part of the digital transformation toolbox for the materials industry has wide-ranging benefits, but the ability to enhance the sustainability of materials and their manufacturing processes could be the most impactful of these.
21 Apr 2023

VDL Enabling Technologies

VDL Enabling Technologies is a contract manufacturer for specialist production lines. At LOPEC 2023 IDTechEx caught up with Director of Business Development Sorin Stan to learn more about how VDL supports the development of printed electronics production lines, and also its vacuum-free atomic layer deposition (ALD) technology.
20 Apr 2023

Readiness Level of Conductive Inks

Innovation roadmap for the report 'Conductive Ink Market 2023-2033'.