Semiconductors, Computing & AI - IDTechEx Reports and Subscriptions

This report characterizes the edge AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2034) across 6 different areas (therein 3 primary regional geographies, consumer and enterprise use, 5 device architectures (GPUs, CPUs, ASICs, DSPs and FPGAs), 3 device packaging types, 3 application areas, and 7 industry verticals) - along with surveys of key edge applications for AI including smartphones, tablets, and automotive - make this the most comprehensive study compiled for AI processors and accelerators at the edge. This report reveals significant opportunity in various parts of the edge AI chip landscape, with the edge AI chip market forecast to grow to over US$22 billion by 2034.

'Flexible Hybrid Electronics 2024-2034' evaluates the status and prospects of this emerging manufacturing methodology, which aims to combine the best aspects of printed and conventional electronics. Often described as 'print what you can, place what you can't', flexible hybrid electronics (FHE) brings the benefits of digital additive electronics manufacturing without compromising on the processing capabilities of integrated circuits. Drawing on years of following the printed electronics industry and 40 interviews, the report outlines trends and innovations in the materials, components, and manufacturing methods required to produce FHE circuits.

This report analyzes air cooling, cold plate/direct-to-chip cooling, immersion cooling, as well as the associated coolant distribution units (CDUs), coolant fluids, thermal interface materials (TIMs), and pumps used in data centers. It evaluates the advantages and disadvantages of each cooling method, presents a roadmap illustrating the market adoption of these technologies by data center IT capacity based on insights from industry leaders, and outlines crucial factors that companies need to consider when supplying components to the data center cooling industry.

This report characterizes the AI chip markets, technologies, and players. Granular forecasts over a 10-year period (up to and including 2033) across 6 different areas (therein 3 primary regional geographies, edge and cloud processing types, 4 device architectures (GPUs, CPUs, ASICs and FPGAs), 3 device packaging types, 4 application areas, and 9 industry verticals), along with one-of-a-kind calculations pertaining to the design, manufacture, ATP, and operation of leading-edge AI chips, make this the most comprehensive study compiled for this AI processors and accelerators. This report reveals significant opportunity in various parts of the AI chip landscape, with the AI chip market forecast to grow to over US$250 billion by 2033.

This report provides holistic and deep coverage of semiconductor usage for a new era of vehicles. Understand the key trends within enabling technologies such as radar, LiDAR, cameras, inverters, battery management systems, MCUs and SOCs and how they impact future semiconductor demand. The report's granular 10-year forecasts include semiconductor wafer demand, semiconductor material demand including Si, SiC, GaN, InGaAs and more, as well as revenue through wafer production in US$.

Semiconductor photonics at the chip-scale is reviewed, with revenue forecasts given for six key markets. Forecasts are disaggregated by specific applications, material platforms (including silicon and indium phosphide), and geography. We show that the semiconductor photonics industry will not reach saturation by 2033, and is growing at an impressive rate. Semiconductor photonics is the best candidate for achieving increasingly high data rate transmissions, over increasingly long distances.

Quantum computing promises a revolution in computational capabilities. This accessible report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing technologies are assessed: superconducting, silicon-spin, photonic, trapped-ion, neutral-atom, topological, diamond-defect, and annealing. Detailed SWOT analysis, company roadmaps, and benchmarking are provided for each modality, along with twenty-year market forecast outlining the prospects of each.

Materials Informatics represents an R&D paradigm shift by fundamentally accelerating the time from innovation to market. There are multiple strategic approaches and many notable success stories; missing this transition will be costly. This report provides key insights into the market, forecasting its growth to 2033. Through technical primary interviews with 24 players, readers will get a detailed understanding of the players, business models, technology, and the application areas.

A new market research report from IDTechEx, "Advanced Semiconductor Packaging 2023-2033," has been published. This report covers the latest advanced semiconductor packaging technology development trends, key player analysis, and market outlook. In addition, this report delivers a profound analysis of the semiconductor industry in general. IDTechEx draws on its data center, autonomous vehicle, 5G, and consumer electronics expertise to offer the reader with an in-depth insight of how advanced semiconductor packaging is affecting these sectors and what their future may hold.

5G deployment is in full swing with continued deployment of infrastructure and 5G compatible devices. However, there are still many challenges to address with many material level challenges around thermal management. This report considers the evolution of 5G antenna design and components to analyse trends in semiconductor technology, the associated die attach materials, power supplies and thermal interface materials. Current and emerging technologies are described along with forecasts across these categories through to 2032.

IDTechEx estimates that today over 50% of new vehicles are shipped with radar, making it a key sensor. Start-ups such as Arbe, Metawave and Oculii are achieving new performance heights, while established suppliers such as Continental, Infineon and NXP are going through a key semiconductor transition. As high levels of autonomy and active safety become more common, IDTechEx's forecast show a radar market 10-year CAGR of 14%.

Electrically conductive adhesive (ECAs) are a competitor to solder. ECAs are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mold electronics, and wearable technologies. This report includes key insights and commercial outlooks for the global electrically conductive adhesive market. The report considers electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs). 10-year ECA market forecasts are given for each application area.

Artificial intelligence (AI) is emerging as a technology that can solve longstanding problems in drug development, including drug discovery. This report highlights the key machine learning and deep learning technologies (architectures and algorithms), companies, and applications driving billion-dollar investments and deals between the biopharma industry and AI drug discovery start-ups. AI will significantly accelerate drug discovery timelines and introduce substantial cost savings for the biopharma industry.

This report provides a detailed technological analysis with available options and emerging possibilities across the whole manufacturing process, from epitaxy, chip manufacturing, mass transfer and assembly, bonding and interconnection, testing, defect management, repair, light management, full colour realization, to backplane and driving. With addressing the challenges and opportunities, together with the supply chain evaluation, market status assessment & prediction, and player activity analysis, it helps the readers to make better strategic decisions, to find the best technological road map, to seek commercialization and new business opportunities, to know reliable partners, to track the activities of key players, and to get the latest industry progress.

This report explores the field of image recognition artificial intelligence (AI) for disease detection by breaking down its five main clinical applications. It describes emerging technologies, highlights key players and analyses market landscape for each sector. Trends, opportunities, threats and challenges (both technical and commercial) are discussed at length, thereby providing detailed insights into the current and future market for this technology.

This report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It builds a detailed quantitative model to forecast the addressable market size for die as well as substrate attach materials in various power electronic functions in all manners of electric vehicles. It also develops ten-year market forecasts, in value and mass, segmenting the market by material type. The materials considered herein include nano silver sintering, micro-silver sintering, Cu sintering, SAC and other solders, and transient liquid phase bonding materials.

IDTechEx's report 'EMI Shielding for Electronics 2024-2034' explores the competing strategies and materials for protecting sensitive electronic components. It covers the transition from board to package level shielding, and from sputtering to spraying/printing. Players and opportunities are evaluated, and demand for EMI materials across multiple application sectors are forecast.

This report characterizes the quantum sensor markets, technologies, and players. Coverage across 17 quantum sensing technology areas, major applications in electric vehicles, navigation, medical imaging and quantum computing with market forecasts from 2024 to 2044. It reveals significant opportunity, with the quantum sensor market forecast to peak at US$7.1bn by 2044.

This comprehensive report draws on IDTechEx's extensive knowledge and experience in the field, offering valuable insights into materials and processing techniques used in advanced semiconductor packaging. It covers crucial technology trends, including the 2.5D packaging process flow and the innovative Cu-Cu hybrid bonding technology for 3D packaging. Additionally, the report provides a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, presenting projections for unit and area metrics.

IDTechEx has been studying telecommunication technologies for many years and we have just released our latest version of the 6G market research report "6G Market 2023-2043: Technology, Trends, Forecasts, Players". This report is built on our expertise, covering the latest 6G technology development trend, key applications, player activities, and market outlook. Key aspects in this report include THz technologies trend, semiconductors for THz communication, THz phase array antenna modules, 6G radio analysis, low-loss materials, packaging trend for 6G, reconfigurable intelligent surfaces (RIS), Metamaterials, Non-terrestrial networks, integrated sensing and communication, 6G market, and future outlook.

The report assesses sustainable methods of electronics manufacturing. It evaluates how sustainable innovations within printed circuit boards and integrated circuits can drive forward a new era of electronics. Featuring granular market forecasts, the report covers different materials and manufacturing processes that can deliver environmental improvements in a way that is scalable and cost-effective. IDTechEx expects that within a decade, 20% of PCBs could be manufactured using more sustainable methods.

The future of solar technology extends far beyond silicon, with numerous alternative materials that belong to a certain class called 'thin film'. These can deliver several unique advantages such as higher efficiency indoor energy harvesting, simpler manufacturing, and potentially lower costs than conventional silicon PV. A particularly exciting opportunity is their role in powering Internet of Things devices - a rapidly growing market following the increasing smartification of home and retail electronics.

Perovskite photovoltaics have already demonstrated remarkable efficiencies, with new applications enabled by their low cost, thin film architecture and tuneable absorption. This IDTechEx report explores the suitability and market opportunities of perovskite PV as well as the innovation opportunities and barriers to entry. It evaluates methods to resolve the main challenge of stability, as well as manufacturing methods and requirements for speciality materials.