In-Mold Electronics 2023-2033
In-Mold Electronics 2023-2033 analyses the technology and market opportunities associated with this emerging manufacturing methodology. Drawing on over 20 company profiles, the majority based on interview, this report evaluates the technical processes, material requirements, applications, and competing methodologies associated with IME such as functional film bonding. It includes 10-year market forecasts by technology and application sector, expressed as both revenue and IME panel area. For the largest target market of automotive interiors, these forecasts for human machine interfaces (HMI) are segmented into mechanical and four distinct types of capacitive switches.