Printed, Flexible and Organic Electronics Report

IME 시장은 2029년까지 11억 1천만 달러를 초과할 것이다

IME(in-mold electronics) (2019-2029년): 기술, 시장 전망 및 기업

제조 공정 및 재료 요건에 대한 기술 평가; 응용 분야 및 기업에 대한 시장 전망; 3D 전자기기로의 경쟁 경로 연구

모두 보기설명목차, 표 및 그림 목록가격
IME(또는 인몰드 전자장치)는 인쇄된 장식에 전자회로를 열성형과 몰딩으로 통합하는 프로세스이다. 결과적으로 회로가 내장된 3D 모양의 물체가 된다. 시장은 약세를 보여왔지만 대규모 도입의 중심에 서 있다. 최대규모의 접근 가능한 시장은 이 기술을 채택하는 여러 단계에 있으며, 자동차 인테리어와 가전제품용 터치 패드가 가장 중요하다. IDTechEx는 IME 장치 시장이 2029년까지 11억 1천만 달러를 넘어설 것으로 전망한다.
In-mold electronics (IME) is a process of integrating printed decorations and electronic circuitry with thermoforming and molding. The results are 3D-shaped objects with embedded circuits of differing degrees of complexity. This is part of the global emerging trend to 3D structural electronics and the progression away from the rudimentary solution of components encased in a box.
The capacity to print electronic circuitry on a 2D substrate prior to converting this into a functional 3D part has many manufacturing and material challenges. This report covers the commercial and emerging solutions from the key players as this technology progresses from R&D to gaining high-volume end-user success.
IDTechEx has a long legacy in the field of printed electronics and has been analysing the forefront of this field. The information for this new report is obtained through extensive interview-based technical primary research.
The advantages of IME are numerous and include: lightweighting, space-saving, robustness, accelerated time-to-market, and high throughput capabilities. However, the technology does not come without its drawbacks in: shape limitations, yield, software immaturity, environmental stability, and post-processing. These merits and hurdles are detailed within the report with upcoming solutions in the material-space for the functional inks, substrates, and adhesives facilitating this.
The prototypes have been diverse, ranging from simple devices for wearable technology, automotive light heating, antennas, and white goods touchpads to more complex sensors, actuators, and displays.
The commercial uptake of IME has a complex history with Ford embracing this technology for an automotive interior device, but the product had to be recalled. Despite this setback the market is on the cusp of large adoption. Very large addressable markets are at different stages of adopting this technology with automotive interiors and touchpads for white goods providing the most significant volumes. IDTechEx forecast the market for IME devices to exceed $1.11bn by 2029.
IME is not the only technological solution to 3D electronics. Aerosol jet printing, Mold Interconnected Devices (including laser direct structuring, two-shot molding, and film inserting), and 3D printing electronics are all rapidly emerging and gaining traction. This report benchmarks these technologies and looks at some of the key players and latest advancements.
Analyst access from IDTechEx
All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.
Further information
If you have any questions about this report, please do not hesitate to contact our report team at or call one of our sales managers:

AMERICAS (USA): +1 617 577 7890
ASIA (Japan): +81 90 1704 1184
EUROPE (UK) +44 1223 812300
Table of Contents
1.1.Introduction to in-mold electronics (IME)?
1.2.Commercial advantages and challenges of IME
1.3.The route to commercialisation
1.4.Overview of key players across the supply chain
1.5.IME market forecast - application
1.6.Benchmarking competitive processes to 3D electronics
2.1.What is in-mold electronics (IME)?
2.2.IME: 3D friendly process for circuit making
2.3.What is the in-mold electronic process?
2.4.Comments on requirements
3.1.New ink requirements: stretchability
3.2.Evolution and improvements in performance of stretchable conductive inks
3.3.Performance of stretchable conductive inks
3.4.Performance of stretchable conductive inks
3.5.The role of particle size in stretchable inks
3.6.The role of resin in stretchable inks
3.7.New ink requirements: portfolio approach
3.8.Diversity of material portfolio
3.9.All materials in the stack must be compatible: conductivity perspective
3.10.All materials in the stack must be compatible: forming perspective
3.11.New ink requirements: surviving heat stress
3.12.New ink requirements: stability
3.13.All materials in the stack must be reliable
3.14.Design: general observations
3.15.SMD assembly: before or after forming
3.16.The need for formable conductive adhesives
4.1.Stretchable carbon nanotube transparent conducting films
4.2.Prototype examples of carbon nanotube in-mold transparent conductive films
4.3.Prototype examples of in-mold and stretchable PEDOT:PSS transparent conductive films
4.4.In-mold and stretchable metal mesh transparent conductive films
4.5.Other in-mold transparent conductive film technologies
4.6.Beyond IME conductive inks: adhesives
5.1.Beyond conductive inks: thermoformed polymeric actuator?
5.2.Thermoformed 3D shaped reflective LCD display
5.3.Thermoformed 3D shaped RGD AMOLED with LTPS
5.4.Molding electronics in 3D shaped composites
6.1.In-mold electronic application: automotive
6.2.White goods, medical and industrial control (HMI)
6.3.Is IME commercial yet?
6.4.First (ALMOST) success story: overhead console in cars
6.5.Commercial products: wearable technology
6.6.Automotive: direct heating of headlamp plastic covers
6.7.Automotive: human machine interfaces
6.8.Automotive: human machine interfaces
6.9.White goods: human machine interfaces
6.11.Consumer electronics and home automation
7.1.In-mold electronics: emerging value chain
7.2.Stretchable conductive ink suppliers multiply
7.3.Stretchable conductive ink suppliers multiply
7.4.IME conductive ink suppliers multiply
9.1.Printing directly on a 3D surface?
9.2.Aerosol: how does it work?
9.3.Aerosol deposition can go 3D
9.4.Applications of aerosol
9.5.Optomec: update on market leader
9.6.Aerosol deposition is already in commercial use
9.7.Nano ink challenges and directions of development for aerosol
10.1.Three approaches to molded interconnect devices
11.1.Moulded Interconnect Devices: Laser Direct Structuring
11.2.Applications of laser direct structuring
11.3.LDS MID: characteristics
11.4.LDS MID: material considerations
11.5.LDS MID: Material considerations (II)
11.6.LDS MID: Laser roughing
11.7.Galvanic plating to the rescue?
11.8.LDS MID: Ease of prototyping and combining 3D printing with LDS?
11.9.Mass manufacturing the all-plastic-substrate paint?
11.10.LDS MID application examples: antenna
11.11.LDS MID application examples: insulin pump and diagnostic laser pen
11.12.LDS MID application examples: automotive HMI
11.13.LDS MID application examples: automotive HMI
11.14.LDS MID in LED implementation
11.15.MID challenges for LED integration
11.16.Expanding LDS MID to non-plastic substrates?
11.17.LDS MID 3D LED retrofit
11.18.LDS MID in LED with improved heat dissipation
11.19.LDS MID in sensors
11.20.LDS MID: fine pitch capability
12.1.Two shot molding: process description
12.2.LDS MID application examples: insulin pump
12.3.Comparing LDS and Two-Shot MID
13.1.Transfer printing: printing test strips & using lamination to compete with IME
13.2.IME with functional films made with evaporated lines
14.1.Printing PCBs: various approaches
14.2.Single-/double-sided printed PCB
14.3.Multi-layer printed PCB (NanoDimension)
14.4.Multi-layer printed PCB (ChemBud)
15.1.The premise of 3D printed electronics
15.2.Routes to 3D printing of structural electronics
15.3.Approaches to 3D printed electronics
15.4.Extrude conductive filament
15.5.Extrude sensing filament
15.6.Conductive plastics using graphene additives
15.7.Conductive plastics using carbon nanotube additives
15.8.Extrude molten solder
15.9.Paste extrusion, dispensing or printing during 3D printing
15.10.Ink requirements for 3D printed electronics
15.11.3D printed with embedded metallization
15.12.Benchmarking different processes (IME, MID, 3DP, aerosol)
16.1.Forecast Methodology
16.2.Ten-year in-mold-electronics market forecast in value
16.3.Ten-year in-mold-electronics market forecast in area
16.4.Estimate of value capture by different elements in an IME product
16.5.Ten-year market forecasts for functional inks in in-mold-electronics
16.6.Ten-year market forecasts for plastic substrates in IME
16.7.Key observations from the MID market
17.2.Butler Technologies, Inc.
17.5.Dupont - In-mold electronics
17.6.Lite-On Mobile
17.7.MesoScribe Technologies
17.8.Nagase America Corporation
17.9.Nascent Objects, Inc
17.10.nScrypt Inc
17.12.Pulse Electronics
17.14.Tangio Printed Electronics
17.15.Teijin Ltd
18.1.In-Mold Electronic market forecast data
18.2.Functional ink and substrate for IME market forecast data

Ordering Information

IME(in-mold electronics) (2019-2029년): 기술, 시장 전망 및 기업

전자 (사용자 1-5명)
전자 (사용자 6-10명)
전자 및 1 하드 카피 (사용자 1-5명)
전자 및 1 하드 카피 (사용자 6-10명)
전자 (사용자 1-5명)
전자 (사용자 6-10명)
전자 및 1 하드 카피 (사용자 1-5명)
전자 및 1 하드 카피 (사용자 6-10명)
전자 (사용자 1-5명)
전자 (사용자 6-10명)
전자 및 1 하드 카피 (사용자 1-5명)
전자 및 1 하드 카피 (사용자 6-10명)
전자 (사용자 1-5명)
전자 (사용자 6-10명)
전자 및 1 하드 카피 (사용자 1-5명)
전자 및 1 하드 카피 (사용자 6-10명)
Click here to enquire about additional licenses.
If you are a reseller/distributor please contact us before ordering.
お問合せ、見積および請求書が必要な方は までご連絡ください。

Subscription Enquiry