5G, 6G, RFID & IoT - IDTechEx Reports and Subscriptions

智能包装有望将电子功能集成到日常产品中，实现状态监控、资产跟踪、消费者参与等。IDTechEx 报告对该新兴行业进行了深入的技术和市场评估，采访了 20 多家行业参与者，包括快速消费品 (FMCG) 企业。  根据公正的分析，IDTechEx 得出结论，根据包装中电子硬件的价值，到 2033 年，全球对电子智能包装的需求将达到 26 亿美元 - 如果还包括基础设施、软件和服务，则更多。

20 多年来，IDTechEx 一直在研究 RFID，我们刚刚发布了最新版本的 RFID 市场研究报告“RFID 预测、参与者和机遇 2023-2033”。此报告以我们的专业知识为基础，涵盖最新的 RFID 发展趋势、关键参与者分析和市场展望。此报告公正审视 RFID 技术、公司、使用案例研究和市场，为读者提供针对整个 RFID 领域的独特见解，包括其现状和未来的可能性。

IDTechEx 多年来一直在研究通信技术，我们刚刚发布了最新版本的 6G 市场研究报告“6G 市场 2023-2043：技术、趋势、预测、参与者”。此报告以我们的专业知识为基础，涵盖最新的 6G 技术发展趋势、关键应用、参与者活动和市场展望。本报告的重点方面包括太赫兹技术趋势、太赫兹通信半导体、太赫兹相控阵天线模块、6G 无线电分析、低损耗材料、6G 封装趋势、可重构智能表面 (RIS)、超材料、非地面网络、集成传感和通信、6G 市场以及未来展望。

随着全球 5G 设备的持续部署，其已成为价值数十亿美元的产业。5G 网络最具革命性的方面依赖于高频 5G 技术，该技术将在本十年后期腾飞。毫米波 5G 设备将使用低损耗材料，以减少 PCB 和封装层面的传输损耗。这将推动 5G 的低损耗材料市场，到 2033 年，该市场的规模将超过 18 亿美元。

此报告探讨光学和射频超材料的 8 种不同应用，包括可重构智能表面、超构透镜和雷达波束成型。它基于与超过 15 家公司的互动，概述关键技术，明确他们的准备度，并评估多种竞争制造方法的适用性。按频率和应用细分的 33 条预测线阐明了超材料市场在未来 20 年将如何发展。

5G deployment is in full swing with continued deployment of infrastructure and 5G compatible devices. However, there are still many challenges to address with many material level challenges around thermal management. This report considers the evolution of 5G antenna design and components to analyse trends in semiconductor technology, the associated die attach materials, power supplies and thermal interface materials. Current and emerging technologies are described along with forecasts across these categories through to 2032.

5G, with its ultra-low latency and high data throughput, is paving the way for a fully digitalized and connected world. However, the fact that 5G uses high frequencies brings the challenge of short signal propagation. Consequently, deploying many small cells to create an ultra-dense network becomes essential. IDTechEx has been studying 5G-related topics for many years and this report "5G small cells 2021-2031: Technologies, Markets, Forecasts" is built on our expertise, covering the main technologies, players, and markets for the 5G small cell industry. Moreover, IDTechEx also provides a series of detailed case studies on selected high potential verticals where 5G small cells can be applied to.

Digital Water 2020-2030 covers the sensor market in water and wastewater treatment and pipe network markets. This comprehensive overview of the different sensor types, companies, strategies and use cases can provide insightful solutions to the digital water industry. This information is then used to forecast the market growth over the coming decade up to 2030, where it is expected to grow to over $2Bn.

此报告强调了在新兴设备和各种应用中部署基于语音的用户界面的趋势，介绍了有语音功能的智能扬声器、麦克风阵列、MEMS 扬声器、语音 SoC、语音识别、自然语言理解和语音合成等硬件和软件技术。这些技术可能会影响非常多的应用，例如汽车、医疗、家庭自动化和教育等。语音用户界面为新的商业模式和收入渠道铺平了道路，有可能改变我们的生活方式。2029 年，其市场价值将达到 155 亿美元。

本报告讲述边缘人工智能芯片市场、技术和参与者的特征。对 6 个不同领域（其中包含 3 个主要区域地理位置、消费者和企业使用、5 种设备架构（GPU、CPU、ASIC、DSP 和 FPGA）、3 种设备封装类型、3 个应用领域和 7 个垂直行业）的 10 年周期（到 2034 年）详细预测，以及对智能手机、平板电脑和汽车等人工智能关键边缘应用的调查，使得本报告成为针对边缘人工智能处理器和加速器编制的最全面的研究。报告揭示了边缘人工智能芯片领域各个方面的重大机遇，预计到 2034 年，边缘人工智能芯片市场的规模将超过 220 亿美元。

《柔性混合电子元件 2024 - 2034》评估该新兴制造方法的现状和前景，该方法旨在将印刷电子和传统电子的优势结合起来。柔性混合电子元件 (FHE) 通常被描述为“印刷你能做到的，安置你无法做到的”，它有数字增材电子制造的优势，而不会影响集成电路的处理能力。根据多年来对印刷电子行业的跟踪和 40 次访谈，本报告概述了生产 FHE 电路所需的材料、组件和制造方法的趋势和创新。

此报告对电动车、数据中心、EMI 屏蔽、5G、ADAS 和消费类电子产品的热界面材料进行了深入的技术分析。还通过应用讲述了 10 年颗粒面积 (m2)、质量 (kg)、收益 (US$) 和 TIM 单价 (US$) 预测。此报告涵盖高性能 TIM 的最新发展、成功商业应用，以及过去的 TIM 参与者收购/合作。报告还明确了未来的 TIM 趋势。

Virtual, augmented, and mixed reality devices promise to revolutionize the way we interact, acting as key gateways to the metaverse. This report builds a picture of these technologies today, quantitively examining development trends to date and outlining both future directions and technical challenges. The changing role of computing and connectivity is discussed, with component technologies including optics, displays, sensing, and haptics analyzed.

The lidar market for automotive applications will grow to US$8.4 billion by 2033. The demand for lidars to be adopted in the automotive industry drives the huge investment and rapid progression of lidars, with the innovations in beam steering technologies, performance improvement, and cost reduction in lidar transceiver components. These efforts can enable lidars to be implemented in a wider application scenario beyond conventional usage and automobiles. IDTechEx leverages its experiences such as in laser physics, semiconductors, optics, sensors, optoelectronics, and transportation, to provide a comprehensive analysis on technologies and products. 10 year market forecasts on lidar units and market value with a focus on automotive have been provided. IDTechEx also tracks the development and activities of 95 global players, with unbiased research and appraisal.

A new market research report from IDTechEx, "Advanced Semiconductor Packaging 2023-2033," has been published. This report covers the latest advanced semiconductor packaging technology development trends, key player analysis, and market outlook. In addition, this report delivers a profound analysis of the semiconductor industry in general. IDTechEx draws on its data center, autonomous vehicle, 5G, and consumer electronics expertise to offer the reader with an in-depth insight of how advanced semiconductor packaging is affecting these sectors and what their future may hold.

This report covers the vertical farming industry, including the technologies and markets involved. We discuss key technologies, including automation and lighting systems, and identify how these could lead to the success of the industry. In-depth analysis of the challenges faced, including quantified considerations on crop limitations and running costs, are considered. Strategies and business models of key companies, including analysis of crop selection and pricing models, are considered and discussed.

Printed sensors are a rapidly growing technology that offer low-cost processing, flexible thin-film form factor and large area sensing, making them suitable for emerging applications such as the Internet of Things (IoT), Industry 4.0, continuous health monitoring and more. This market research report covers the technology and applications of printed photodetectors, piezoresistive and piezoelectric pressure sensors, strain sensors, temperature sensors, printed electrodes, biosensors, and capacitive touch sensors.

IDTechEx has tracked the technology, player and market development of flexible, thin film and printed batteries since 2014. This report provides detailed technological analysis, market status introduction, market assessment, opportunity and barrier discussion, player activity tracking, and gives 10-year market forecast by technology and application.

耳穿戴产品是置入耳内，夹在耳上及周围部位的无线电子产品。包括耳机、助听器、人工电子耳蜗等相关领域的产品。这类产品可应用于信息娱乐，听力辅助与增强，健康监测等场景，主要是消费类电子及医疗保健等行业。这份报告是对整个耳穿戴产品市场及其技术前景最全面的回顾。

随着技术的发展（如第三代 DNA 测序、数字 PCR 和微流体器件），即时分子诊断市场的增长，以及具有可靠临床实用性的基因生物标记的不断发现，分子诊断成为了医疗保健行业中增长最快的市场之一。到 2030 年，分子诊断市场的规模预计将达到 200 亿美元。