Semiconductors - IDTechEx Reports and Subscriptions

半导体光子集成电路 2023-2033 

报告回顾了芯片级半导体光子技术,并给出了六大关键市场的收益预测。预测按具体应用、材料平台(包括硅和磷化铟)和地理位置分列。我们认为,半导体光子行业到 2033 年不会达到饱和,并且正在以惊人的速度增长。半导体光子是在越来越长的距离实现越来越高的数据传输速率的不二之选。
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量子计算 2023-2043 

量子计算预示着一场计算能力的革命。这份通俗易懂的报告评估该新兴行业的关键技术、公司、增长驱动因素和应用障碍。同时评估多种竞争性技术:超导、硅自旋、光子、俘获离子、中性原子、拓扑、钻石瑕疵和退火。报告针对每种模式提供详细的 SWOT 分析、公司路线图和基准化,以及 20 年市场预测,概述每种模式的前景。
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可持续电子制造 2023-2033 

报告评估了电子制造的可持续方法。它评估了印刷电路板和集成电路内的可持续创新如何推动电子新时代的发展。报告包含精细的市场预测,涵盖不同的材料和制造工艺,并确保它们能以可扩展且具有成本效益的方式改善环境。IDTechEx 预计,在十年内,20% 的印刷电路板将可使用更加可持续的方法制造。
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薄膜和柔性光伏 2023-2033 

The future of solar technology extends far beyond silicon, with numerous alternative materials that belong to a certain class called 'thin film'. These can deliver several unique advantages such as higher efficiency indoor energy harvesting, simpler manufacturing, and potentially lower costs than conventional silicon PV. A particularly exciting opportunity is their role in powering Internet of Things devices - a rapidly growing market following the increasing smartification of home and retail electronics.
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先进半导体封装 2023-2033 

A new market research report from IDTechEx, "Advanced Semiconductor Packaging 2023-2033," has been published. This report covers the latest advanced semiconductor packaging technology development trends, key player analysis, and market outlook. In addition, this report delivers a profound analysis of the semiconductor industry in general. IDTechEx draws on its data center, autonomous vehicle, 5G, and consumer electronics expertise to offer the reader with an in-depth insight of how advanced semiconductor packaging is affecting these sectors and what their future may hold.
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钙钛矿光伏 2023 - 2033 

Perovskite photovoltaics have already demonstrated remarkable efficiencies, with new applications enabled by their low cost, thin film architecture and tuneable absorption. This IDTechEx report explores the suitability and market opportunities of perovskite PV as well as the innovation opportunities and barriers to entry. It evaluates methods to resolve the main challenge of stability, as well as manufacturing methods and requirements for speciality materials.
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5G 热管理 2022-2032 

5G deployment is in full swing with continued deployment of infrastructure and 5G compatible devices. However, there are still many challenges to address with many material level challenges around thermal management. This report considers the evolution of 5G antenna design and components to analyse trends in semiconductor technology, the associated die attach materials, power supplies and thermal interface materials. Current and emerging technologies are described along with forecasts across these categories through to 2032.
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汽车雷达 2022-2042 

IDTechEx estimates that today over 50% of new vehicles are shipped with radar, making it a key sensor. Start-ups such as Arbe, Metawave and Oculii are achieving new performance heights, while established suppliers such as Continental, Infineon and NXP are going through a key semiconductor transition. As high levels of autonomy and active safety become more common, IDTechEx's forecast show a radar market 10-year CAGR of 14%.
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电动车的动力电子组件 2022-2032 

Electric vehicles are taking the world by storm with BEV and PHEV cars expected to grow at 25% CAGR through 2032. Advancements to automotive power electronics are critical for improving range and charging times. The new IDTechEx report provides analysis and forecasts for three key devices: inverters, onboard chargers (OBC), and DC-DC converters, split by voltage (including 800V) and semiconductor technology (silicon carbide SiC MOSFET and silicon Si IGBTs).
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导电胶粘剂 2022-2032:技术、市场和预测 

Electrically conductive adhesive (ECAs) are a competitor to solder. ECAs are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mold electronics, and wearable technologies. This report includes key insights and commercial outlooks for the global electrically conductive adhesive market. The report considers electrically conductive adhesives (ECAs), including isotropic conductive adhesives (ICAs), anisotropic conductive pastes (ACPs) and anisotropic conductive films (ACFs). 10-year ECA market forecasts are given for each application area.
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微型 LED 显示屏 2021-2031:技术、商业化、机会、市场和参与者 

This report provides a detailed technological analysis with available options and emerging possibilities across the whole manufacturing process, from epitaxy, chip manufacturing, mass transfer and assembly, bonding and interconnection, testing, defect management, repair, light management, full colour realization, to backplane and driving. With addressing the challenges and opportunities, together with the supply chain evaluation, market status assessment & prediction, and player activity analysis, it helps the readers to make better strategic decisions, to find the best technological road map, to seek commercialization and new business opportunities, to know reliable partners, to track the activities of key players, and to get the latest industry progress.
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柔性混合电子元件 2020 - 2030:应用、挑战、创新和预测 

This IDTechEx Research report covers all aspects of Flexible Hybrid Electronics, including an assessment of the enabling technologies and challenges, over 30 prototype case studies, technology adoption roadmaps, and detailed market forecasts. FHE is set to disrupt the existing electronics landscape, finally realizing the vision of ubiquitous electronics and facilitating novel applications. The trends, forecasts and innovation opportunities outlined in this report provide a roadmap to this transition.
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电动车动力电子组件芯片键合材料 2020-2030 

此报告调查了各种电动交通工具动力电子组件中使用的各种芯片贴装和衬底贴装材料的市场。其中建立了一个详细的定量模型,以预测所有形式电动交通工具各种动力电子功能的芯片贴装和衬底贴装材料的可实现市场规模。报告还针对价值和质量制定了十年市场预测,按照材料类型对市场进行了细分。报告中提及的材料包括纳米银烧结、微银烧结、铜烧结、SAC 及其他焊料和瞬态液相粘结材料。
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新兴图像传感器技术 2023-2033:应用和市场 

新兴图像传感器技术的市场包括混合图像传感器、基于事件的视觉、大范围溶液加工光电探测器、柔性 X 光探测器、高光谱成像和扩展范围硅探测器,它们既能降低成本,又能在新应用中得到采用。此报告概述了新兴图像传感器格局,提供了广泛的技术和商业评估以及市场预测。包括 40 多条预测线和 25 份公司概况。
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6G 市场 2023-2043:技术、趋势、预测、参与者 

IDTechEx 多年来一直在研究通信技术,我们刚刚发布了最新版本的 6G 市场研究报告“6G 市场 2023-2043:技术、趋势、预测、参与者”。此报告以我们的专业知识为基础,涵盖最新的 6G 技术发展趋势、关键应用、参与者活动和市场展望。本报告的重点方面包括太赫兹技术趋势、太赫兹通信半导体、太赫兹相控阵天线模块、6G 无线电分析、低损耗材料、6G 封装趋势、可重构智能表面 (RIS)、超材料、非地面网络、集成传感和通信、6G 市场以及未来展望。
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